Fluid Precision Polishing Equipment-KDLGD2511 Water Particle Flow Polishing Machine

Precision water particle flow polishing machine

The difference between the smank water particle flow polishing machine and the abrasive flow process is that the abrasiveFlow uses semi-solid fluid abrasive as grinding medium, while water particle flow polishing machine makesThe particle liquid abrasive is used as the grinding medium.The particle liquid abrasive has very low viscosity and is very easy to clean. Available at very small apertureAnd is less affected by the length of the aperture.So this process is more suitable Deburring, slag removal, oxide layer removal of complex inner cavity or surface, or small caliberPolishing of pipe fittings.The abrasive does not contain any corrosive, oily or harmful substances to the environment and human body Quality, no dust during processing, environmental protection and safety.

Main Features And Applications:

Features: Ultra-precision machining: suitable for hard and brittle materials (ceramics, sapphire) and high-precision metal parts.Cold polishing: no thermal deformation, maintaining the original properties of the material.Adjustable parameters: water pressure (50~300MPa) and abrasive concentration can be freely controlled to adapt to workpieces of different hardness.Applications:Optical components: final polishing of lenses and prisms.Semiconductors: surface treatment of silicon wafers and silicon carbide substrates.Medical implants: biocompatible polishing of artificial joints and dental implants.